Process for molding scale wafer smooth plastic brush wires

The invention discloses a process for molding scale wafer smooth plastic brush wires. The process comprises the following steps: 1, adding 1-45 percent of mica powder having a proper fineness into 55-99 percent of PBT (PET) resin; 2, stirring and mixing, and preparing masterbatches from the mixture by adopting a plastic granulator; 3, adding 1-50 percent of the masterbatches into the PBT (PET) resin; 4, drying by adopting a dryer, and uniformly mixing through a mixer; and 5, preparing brush wires by adopting an extrusion drawbench, wherein drying is carried out at the temperature of 125-140 DEG C for 3.8-4.2 hours by adopting the dryer in the step 4. According to the method, fine mica powder is added into drawing raw materials, and the wires have scale and wafer shaped appearance by utilizing the scale shape and smooth performance of the mica powder (especially sericite); the appearance has a pig shape; and the brush wires have unique smoothness, dispersion and verticality performance. 本发明公开了种鳞片晶片丝滑塑胶刷丝的成型工艺，