Laser cutting system and method for epoxy resin packaging sheet

The invention belongs to the field of laser cutting, and particularly relates to a laser cutting system and method for an epoxy resin packaging sheet. The laser cutting system comprises a laser, a beam expander, a light spot shaping system, a focusing lens and an X-Y motion stage, wherein the X-Y motion stage is used for fixing a to-be-cut workpiece; and the light spot shaping system comprises a replaceable parallel six-light-point DOE light spot shaping system and a replaceable vertical three-light-spot DOE light spot shaping system. After being transmitted to the beam expander, a light beamemitted by the laser is converted into parallel light beam, and then the parallel light beam perpendicularly penetrates into the light spot shaping system; after the shaping operation, a light spot applicable to welding is obtained; through the focusing lens, the shaped light beam is focused on the surface of an epoxy resin sample, so that the instant gasification of a resin material can be achieved, a matrix material can