An embedded heat dissipation mechanism of a microelectronic circuit board
The invention discloses an embedded heat dissipation mechanism of a microelectronic circuit board, comprises a heat dissipation cylinder and a snap ring, the snap ring is horizontally arranged at themiddle position of the top of the heat dissipation cylinder, and is welded with the heat dissipation...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention discloses an embedded heat dissipation mechanism of a microelectronic circuit board, comprises a heat dissipation cylinder and a snap ring, the snap ring is horizontally arranged at themiddle position of the top of the heat dissipation cylinder, and is welded with the heat dissipation cylinder, the side surface of the heat dissipation cylinder is provided with a heat conduction pipe, the heat conduction pipe is arranged around the side wall of the heat dissipation cylinder, and is welded with the heat dissipation cylinder, the side surface of the heat dissipation cylinder is formed with an air permeable hole, the embedded heat dissipation mechanism of the microelectronic circuit board has good heat conduction performance, After the mechanism is embedded and installed, Duringnormal operation, the heat of the external assembly is rapidly conducted through a heat conduction pipe, Further, the assembly is quickly radiated by the mechanism, the temperature of the external component is kept constant, |
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