Low-melting-point metal micro-nano powder conductive adhesive and preparation method thereof

Low-melting-point metal micro-nano powder conductive adhesive and preparation method thereof

The invention provides a low-melting-point metal micro-nano powder conductive adhesive. The adhesive comprises, by mass, 50-90% of conductive filler and 10-50% of matrix resin, wherein the conductivefiller comprises, by mass, 50-90% of low-melting-point metal micro-nano powder and 10-50% of silver p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TIAN PENG, CHEN JIAN, CAI CHANGLI, DENG ZHONGSHAN, DONG SHENGQUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:The invention provides a low-melting-point metal micro-nano powder conductive adhesive. The adhesive comprises, by mass, 50-90% of conductive filler and 10-50% of matrix resin, wherein the conductivefiller comprises, by mass, 50-90% of low-melting-point metal micro-nano powder and 10-50% of silver powder. The invention further provides preparation and application of the low-melting-point metal micro-nano powder conductive adhesive. Compared with Pd-Sn alloy and lead-free solder, the conductive adhesive has the advantages of being environmentally friendly, good in low-temperature bonding and adhesive force, high in fine line printing capacity and capable of being used for being connected with a flexible circuit. Compared with conductive silver adhesives and copper adhesives in the currentmarket, the conductive adhesive has the advantages of being good in heat conduction performance, small in volume resistivity, high in bonding strength, simple in process and the like; meanwhile, a preparation method is simple