Thermosetting resin composition, prepreg, laminate and printed circuit board

The disclosure provides a thermosetting resin composition, prepreg, a laminate and a printed circuit board. The thermosetting resin composition comprises thermosetting resin, a curing agent, and a silicon dioxide filler having a boron nitride coating layer on the surface, wherein the weight ratio of the silicon dioxide filler with the boron nitride coating layer on the surface to the sum of the thermosetting resin and curing agent is 5-50% by weight; the boron nitride coating layer accounts for 1-20% of the total weight of the silicon dioxide filler with the boron nitride coating layer on thesurface. By adding the silicon dioxide filler with the boron nitride coating layer on the surface into the thermosetting resin composition, the prepreg, laminate and printed circuit board prepared with the thermosetting resin composition can gain high heat conductivity and high viscosity; in addition, the usage of boron nitride can be reduced, so that production cost is reduced. 本公开提供种热固性树脂组合物、预浸料、层压板和印制电路板。热固性树脂组合物包含下列组分