Device and method of real-time controllable sol jetting based on C-cutting of lithium niobate wafer

The invention discloses a device and method of real-time controllable sol jetting based on C-cutting of a lithium niobate wafer. The device comprises a laser 1, a shutter 2, a CCD camera 3, a band-stop light filter 4, a semi-permeable and semi-reflective mirror 5, an objective lens 6, the lithium niobate wafer 7, a quartz wafer 8 and a background light source 9. A parallel symmetrical structure composed of the lithium niobate wafer 7 and the quartz wafer 8 is taken as a core device, and the core device realizes that sol to be jetted is jetted for a trace amount of sol liquid drops to any position of the lithium niobate wafer 7 by cooperating with the laser 1 and the shutter 2. According to the device and method, the lithium niobate wafer is utilized to realize jetting of the sol prepared by a sol-gel method, and the size and position of jetted sol drops are controllable meanwhile. The development of the technology in biomedical, chemical detection, film preparation and other fields isof a great significance.