A photoelectric sensor packaging structure with a pad block and a packaging method thereof

The invention discloses a photoelectric sensor packaging structure with a pad block and a packaging method thereof. The photoelectric sensor packaging structure comprises a substrate, an adhesive filmstructure is arranged on the substrate, and a second chip is packaged inside the adhesive film structure. A pad block is arranged on the adhesive film structure, and a first chip is arranged on the pad block; the negative electrode surface of the second chip is electrically connected with the pad block. The positive electrode surface of the second chip faces upward and the positive electrode surface is covered with glass. The structure can meet the packaging requirements of the photoelectric sensor, and make the packaging size of the existing photoelectric sensor smaller, and better meet theexisting medical needs. 本发明公开了种带有垫块的光电传感器封装结构及其封装方法，包括基板，基板上设置有胶膜结构，胶膜结构内部封装有第二芯片；胶膜结构上设置有垫块，垫块上设置有第芯片；第二芯片的负极面与垫块电性连接，第二芯片的正极面朝上，且正极面上覆盖有玻璃。能够满足光电传感器的封装要求，并且使现有的光电传感器的封装尺寸更小，更好的满足现有的医疗需求。