Device module with built-in switch chip and manufacturing method thereof

The invention provides a device module with a built-in switch chip and a manufacturing method thereof. The device module comprises: a double-sided circuit board, wherein a first pad is arranged on a first surface of the double-sided circuit board and a second pad is arranged on a second surface opposite to the first surface of the double-sided circuit board; a heat dissipation substrate with a built-in electrically insulating heat dissipator and arranged on the first surface side of the double-sided circuit board; a switch chip embedded in the heat dissipation substrate, wherein the pins of the switch chip are bonded on the first pad, and the other side of the switch chip relative to the pin side is thermally connected with the electrically insulating heat dissipation body; an energy storage device having pins soldered to the second pad. The invention has excellent heat dissipation performance, and can reduce the line length between the switch chip and the energy storage device, thereby effectively reducing t