High-peeling-strength paper-based copper-clad plate copper foil glue

The invention discloses high-peeling-strength paper-based copper-clad plate copper foil glue. A manufacture method of the copper foil glue includes the steps: firstly, modified barium phenolic resin synthesis: 1) adding 2350-2450 parts of phenol, 3000-3200 parts of formaldehyde and 120-140 parts of melamine formaldehyde resin into a reaction kettle, adding 25-28 parts of barium hydroxide under a stirring condition, and performing reaction in a heating manner; 2) performing vacuum pumping pressure reduction and dehydration after reaction, adding 380-2300 parts of solvent after completing, stirring mixture, cooling the stirred mixture, and storing the cooled mixture for standby application; secondly, mixing and dissolving 240-260 parts of prepared modified barium phenolic resin, 150-160 parts of polyvinyl butyral, 18-22 parts of basic epoxy resin in 1090-1310 parts of organic solvents to prepare the copper foil glue. The prepared copper foil glue obviously improves the peeling strengthof a copper-clad plate and