A heat dissipation device and a heat dissipation method of a power supply isolation module

The invention discloses a heat dissipation device and a heat dissipation method of a power supply isolation module, belonging to the technical field of heat dissipation of an electric function module.The heat dissipation device of the power supply isolation module of the invention comprises a chassi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: QI HUIXING, LIANG JIBIN, ZHANG CHANGQIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a heat dissipation device and a heat dissipation method of a power supply isolation module, belonging to the technical field of heat dissipation of an electric function module.The heat dissipation device of the power supply isolation module of the invention comprises a chassis, a power supply isolation module, a plurality of heat dissipation tubes and a fan. The power supply isolation module and the fan are arranged on the bottom shell of the chassis, and the heat dissipation tubes are arranged on the bottom shell and are in contact with the power supply isolation module. The heat dissipation device of the power supply isolation module of the invention can uniformly dissipate heat, and has good popularization and application value. 本发明公开了种电源隔离模块散热装置及散热方法,属于电气功能模块散热技术领域。本发明的电源隔离模块散热装置,包括机箱,还包括电源隔离模块、若干散热管和风扇,所述电源隔离模块、风扇分别设置于机箱底壳上,散热管设置于底壳上,且与电源隔离模块相接触。该发明的电源隔离模块散热装置能够均温散热,具有很好的推广应用价值。