Pressure adjusting device

The invention relates to the technical field of semiconductor manufacturing, in particular to a pressure adjusting device. The pressure adjusting device comprises an exhaust part including an exhaustpump and an exhaust pipe for communicating the reaction chamber with the exhaust pump; An injection part communicating with the exhaust pipe for injecting compensation gas into the reaction chamber from the exhaust pipe; A control unit configured to adjust a flow rate at which the compensation gas is injected into the injection unit according to pumping information of the suction pump so that a pressure in the reaction chamber is maintained at a preset pressure. The invention improves the accuracy of the pressure control in the reaction chamber and improves the quality of the semiconductor process. 本发明涉及半导体制造技术领域，尤其涉及种压力调整装置。所述压力调整装置包括：排气部，包括抽气泵、以及用于连通反应腔室与所述抽气泵的排气管；注入部，连通所述排气管，用于自所述排气管向所述反应腔室内注入补偿气体；控制部，用于根据所述抽气泵的泵送信息调整所述注入部注入所述补偿气体的流速，使得所述反应腔室内的压力保持在预设压力。本发明提高了对反应腔室内压力控制的准确度，改善了半导体工艺制程的质量。