Method for preparing heat conductive paste for computer CPU radiator

A method for preparing heat conductive paste for computer CPU radiator nanometer-sized zinc oxide particles, silicon powder, boron nitride, xylene, zinc oxide, sodium fluorosilicate, silica, ammoniumsulfate, zirconium silicate, ammonium chloride, sodium perborate, FeSO4, potassium hydroxide and fumed silica. Compared with the prior art, the heat conduction paste prepared by the formula of the invention has high-efficiency viscosity, and the CPU and the heat sink are well adhered. The heat sink after the adhered can conduct heat on the CPU well, thereby improving the heat dissipation performance, and has the value of popularization and application. 本发明公开了种计算机CPU散热器用导热膏制备方法，由纳米级氧化锌颗粒、硅粉、氮化硼、二甲苯、氧化锌、氟硅酸钠、二氧化硅、硫酸铵、硅酸锆、氯化铵、过硼酸钠、硫酸亚铁、氢氧化钾、气相二氧化硅制成，与现有技术相比，本发明的配方制成的导热膏具有高效的粘性，将CPU与散热器良好的贴覆，贴覆后的散热器能够良好的传导CPU上的热量，从而提高散热性能，具有推广应用的价值。