Wafer gripper assembly, system and use thereof
The present invention discloses a wafer gripper assembly, a system and a use thereof. The wafer gripper assembly is provided with at least one wafer gripper (50) comprising a base (51) and a bridge element (52), vacuum means comprising a hose (53) for applying a negative pressure and at least one su...
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| creator | RONALD HENRICA MARIA VAN DIJK PETER ROELF VENEMA MARTEN RONALD RENES JOHANNES REINDER MARC LUCHIES |
| description | The present invention discloses a wafer gripper assembly, a system and a use thereof. The wafer gripper assembly is provided with at least one wafer gripper (50) comprising a base (51) and a bridge element (52), vacuum means comprising a hose (53) for applying a negative pressure and at least one suction zone (54) adapted to hold a wafer (10) by means of the applied negative pressure, and a frame(60) coupled to the bridge element (52). The frame (60) is provided with positioning means (57) adapted to contact a wafer boat to position the wafer at a predefined distance from the wafer boat. An elastic connector (56) is provided between the frame (60) and either the bridge member (52) or a retaining plate (70) comprising the suction devices (54) when such a retaining plate is present.
本申请公开了晶圆夹持器组件、系统及其用途。晶圆夹持器组件设置有至少个晶圆夹持器(50)，该晶圆夹持器包括基座(51)和桥接元件(52)；真空装置，其包括用于施加负压的软管(53)和至少个抽吸区域(54)，被配置用于借助于所施加的负压保持晶圆(10)；框架(60)，其联接到桥接元件(52)。框架(60)设置有被配置用于接触晶圆舟的定位装置(57)，以便将晶圆定位在距晶圆舟的预定距离处。在框架(60)与桥接元件(52)或包括抽吸设备(54)的保持板(70)之间存在 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN109003934A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN109003934A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN109003934A3</originalsourceid><addsrcrecordid>eNrjZNALT0xLLVJIL8osKADSicXFqblJOZU6CsWVxSWpuQqJeSkKpcWpCiUZqUWp-Wk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_QwNLAwNjS2MTRmBg1AOiMKls</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer gripper assembly, system and use thereof</title><source>esp@cenet</source><creator>RONALD HENRICA MARIA VAN DIJK ; PETER ROELF VENEMA ; MARTEN RONALD RENES ; JOHANNES REINDER MARC LUCHIES</creator><creatorcontrib>RONALD HENRICA MARIA VAN DIJK ; PETER ROELF VENEMA ; MARTEN RONALD RENES ; JOHANNES REINDER MARC LUCHIES</creatorcontrib><description>The present invention discloses a wafer gripper assembly, a system and a use thereof. The wafer gripper assembly is provided with at least one wafer gripper (50) comprising a base (51) and a bridge element (52), vacuum means comprising a hose (53) for applying a negative pressure and at least one suction zone (54) adapted to hold a wafer (10) by means of the applied negative pressure, and a frame(60) coupled to the bridge element (52). The frame (60) is provided with positioning means (57) adapted to contact a wafer boat to position the wafer at a predefined distance from the wafer boat. An elastic connector (56) is provided between the frame (60) and either the bridge member (52) or a retaining plate (70) comprising the suction devices (54) when such a retaining plate is present.
本申请公开了晶圆夹持器组件、系统及其用途。晶圆夹持器组件设置有至少个晶圆夹持器(50)，该晶圆夹持器包括基座(51)和桥接元件(52)；真空装置，其包括用于施加负压的软管(53)和至少个抽吸区域(54)，被配置用于借助于所施加的负压保持晶圆(10)；框架(60)，其联接到桥接元件(52)。框架(60)设置有被配置用于接触晶圆舟的定位装置(57)，以便将晶圆定位在距晶圆舟的预定距离处。在框架(60)与桥接元件(52)或包括抽吸设备(54)的保持板(70)之间存在</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181214&DB=EPODOC&CC=CN&NR=109003934A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181214&DB=EPODOC&CC=CN&NR=109003934A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RONALD HENRICA MARIA VAN DIJK</creatorcontrib><creatorcontrib>PETER ROELF VENEMA</creatorcontrib><creatorcontrib>MARTEN RONALD RENES</creatorcontrib><creatorcontrib>JOHANNES REINDER MARC LUCHIES</creatorcontrib><title>Wafer gripper assembly, system and use thereof</title><description>The present invention discloses a wafer gripper assembly, a system and a use thereof. The wafer gripper assembly is provided with at least one wafer gripper (50) comprising a base (51) and a bridge element (52), vacuum means comprising a hose (53) for applying a negative pressure and at least one suction zone (54) adapted to hold a wafer (10) by means of the applied negative pressure, and a frame(60) coupled to the bridge element (52). The frame (60) is provided with positioning means (57) adapted to contact a wafer boat to position the wafer at a predefined distance from the wafer boat. An elastic connector (56) is provided between the frame (60) and either the bridge member (52) or a retaining plate (70) comprising the suction devices (54) when such a retaining plate is present.
本申请公开了晶圆夹持器组件、系统及其用途。晶圆夹持器组件设置有至少个晶圆夹持器(50)，该晶圆夹持器包括基座(51)和桥接元件(52)；真空装置，其包括用于施加负压的软管(53)和至少个抽吸区域(54)，被配置用于借助于所施加的负压保持晶圆(10)；框架(60)，其联接到桥接元件(52)。框架(60)设置有被配置用于接触晶圆舟的定位装置(57)，以便将晶圆定位在距晶圆舟的预定距离处。在框架(60)与桥接元件(52)或包括抽吸设备(54)的保持板(70)之间存在</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNALT0xLLVJIL8osKADSicXFqblJOZU6CsWVxSWpuQqJeSkKpcWpCiUZqUWp-Wk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_QwNLAwNjS2MTRmBg1AOiMKls</recordid><startdate>20181214</startdate><enddate>20181214</enddate><creator>RONALD HENRICA MARIA VAN DIJK</creator><creator>PETER ROELF VENEMA</creator><creator>MARTEN RONALD RENES</creator><creator>JOHANNES REINDER MARC LUCHIES</creator><scope>EVB</scope></search><sort><creationdate>20181214</creationdate><title>Wafer gripper assembly, system and use thereof</title><author>RONALD HENRICA MARIA VAN DIJK ; PETER ROELF VENEMA ; MARTEN RONALD RENES ; JOHANNES REINDER MARC LUCHIES</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109003934A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>RONALD HENRICA MARIA VAN DIJK</creatorcontrib><creatorcontrib>PETER ROELF VENEMA</creatorcontrib><creatorcontrib>MARTEN RONALD RENES</creatorcontrib><creatorcontrib>JOHANNES REINDER MARC LUCHIES</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RONALD HENRICA MARIA VAN DIJK</au><au>PETER ROELF VENEMA</au><au>MARTEN RONALD RENES</au><au>JOHANNES REINDER MARC LUCHIES</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer gripper assembly, system and use thereof</title><date>2018-12-14</date><risdate>2018</risdate><abstract>The present invention discloses a wafer gripper assembly, a system and a use thereof. The wafer gripper assembly is provided with at least one wafer gripper (50) comprising a base (51) and a bridge element (52), vacuum means comprising a hose (53) for applying a negative pressure and at least one suction zone (54) adapted to hold a wafer (10) by means of the applied negative pressure, and a frame(60) coupled to the bridge element (52). The frame (60) is provided with positioning means (57) adapted to contact a wafer boat to position the wafer at a predefined distance from the wafer boat. An elastic connector (56) is provided between the frame (60) and either the bridge member (52) or a retaining plate (70) comprising the suction devices (54) when such a retaining plate is present.
本申请公开了晶圆夹持器组件、系统及其用途。晶圆夹持器组件设置有至少个晶圆夹持器(50)，该晶圆夹持器包括基座(51)和桥接元件(52)；真空装置，其包括用于施加负压的软管(53)和至少个抽吸区域(54)，被配置用于借助于所施加的负压保持晶圆(10)；框架(60)，其联接到桥接元件(52)。框架(60)设置有被配置用于接触晶圆舟的定位装置(57)，以便将晶圆定位在距晶圆舟的预定距离处。在框架(60)与桥接元件(52)或包括抽吸设备(54)的保持板(70)之间存在</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Wafer gripper assembly, system and use thereof |
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