A manufacturing method of an arbitrary layer PCB

The invention discloses a manufacturing method of an arbitrary layer PCB, wherein a build-up method is adopted to symmetrically overlap the line layer so as to obtain the laminated plate; Taking out the separating plate from the pressing plate to obtain two prefabricated plates with the same structu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAN DONGDONG, PIAO ZHENGQUAN, PIAO XUANCHANG, ZHOU JUNJIE, HOU LULU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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