A manufacturing method of an arbitrary layer PCB

The invention discloses a manufacturing method of an arbitrary layer PCB, wherein a build-up method is adopted to symmetrically overlap the line layer so as to obtain the laminated plate; Taking out the separating plate from the pressing plate to obtain two prefabricated plates with the same structure; At that upper and low sides of the prefabricate plate, adopting a build-up method symmetricallyoverlaps the line layer to obtain an arbitrary layer PCB board; The method of the invention takes the separating plate as a longitudinal symmetrical central symmetrical laminate plate, realizes 2PNL molding when the separating plate is pressed together for the first time, and combines the 2PNL Dummy area, thereby increasing the thickness of the initial product and meeting the production requirements of the HDI process. 本发明公开了种任意层PCB板的制作方法，在隔离板上下两侧采用Build-up方法对称叠加线路层，获得压合板；从所述的压合板中取出所述的隔离板，获得两张结构相同的预制板；在所述预制板上下两侧采用Build-up方法对称叠加线路层，获得任意层PCB板；本发明提供的方法以隔离板为纵向对称中心对称叠板，第次压合时就能实现2PNL成型，并将2PNL Dummy区域相结合，从而提高初期产品的厚度，达到HDI制程生