THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness. 种封装件包括封装组件，位于封装组件上方并且接合至封装组件的器件管芯，具有位于器件管芯上方的顶部的金属帽，以及位于器件管芯和金属帽之间并且接触器件管芯和金属帽的热界面材料。热界面材料包括直接位于器件管芯的内部上方的第部分，以及直接在器件管芯的拐角区域上方延伸的第二部分。第部分具有第厚度。第二部分具有大于第厚度的第二厚度。