Method for processing wafer

Provided is a method for processing a wafer, which can easily transfer the wafer from a protective tape to another adhesive tape. After the protective tape (T) is pasted on a front (Wa) side of the wafer (W), a cutting tool (12) cuts in a peripheral edge of the wafer from the protective tape side to rotate the wafer, thereby cutting and removing a chamfer part (Wc) of the front side of the wafer together with the protective tape in a round shape. In addition, the cutting tool (14) is utilized to cut and remove tape burrs (B) on an edge of the protective tape. Then, the protective tape side ofthe wafer is held on the chuck working table of a grinding device and the reverse side (Wb) of the wafer is ground, another adhesive tape (Tp) is pasted on the reverse side of the wafer, and the protective tape is stripped and transferred. During the transfer, the chamfer part is cut and removed together with the protective tape, thus during grinding and transfer, the protective tape does not stretch out from the peripher