Electronic package and method for manufacturing the same

The present invention provides an electronic package and a method for manufacturing the same, the first package layer is formed on a carrier having a line, the electronic component is disposed on thefirst package layer, the antenna structure is formed to form the first package layer, the antenna structure and the line of the carrier are isolated, so that when the antenna structure receives or emits electromagnetic waves, signal transmission of the antenna structure interferes with the line of the carrier can be reduced. 种电子封装件及其制法，通过于具有线路的承载件上形成第封装层，再于该第封装层上设置电子组件及形成该天线结构，以藉由该第封装层隔离该天线结构与该承载件的线路，故当该天线结构于接收或发射电磁波时，能减少该天线结构干涉该承载件的线路的信号传输。