Printed circuit board assembly and packaging method thereof, and motor vehicle

Embodiments of the invention provide a method for packaging a printed circuit board assembly (PCBA), a packaged PCBA module and a motor vehicle. The method comprises the following steps: providing theprinted circuit board assembly, wherein the printed circuit board assembly comprises a printed circu...

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Bibliographische Detailangaben
1. Verfasser: STPHANE JOSEPH SCHULER
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Embodiments of the invention provide a method for packaging a printed circuit board assembly (PCBA), a packaged PCBA module and a motor vehicle. The method comprises the following steps: providing theprinted circuit board assembly, wherein the printed circuit board assembly comprises a printed circuit board (PCB) and a plurality of components assembled on the printed circuit board; providing a support which is configured to carry the printed circuit board assembly and define a space for housing the printed circuit board assembly; placing the printed circuit board assembly in the space of thesupport so that the printed circuit board assembly is carried and positioned by the support, and placing the support and the printed circuit board assembly carried by the support into a mould; and filling a polymer material into the mold using the molding process to form a package structure that at least encapsulates the printed circuit board assembly and fixes the printed circuit board assembly relative to the support. 本发