Angled semiconductor device of bare core

The invention discloses a semiconductor device installed on a signal carrier medium such as a printed circuit board at a certain angle. The semiconductor device comprises a stack of semiconductor barecores stacked in stepped offset configuration. A bare core stack body can be encapsulated in a molding body material. A molding compound can be divided by oblique cutting along two opposite edges. Holes can be drilled in the oblique edges so as to expose electrical contact on each semiconductor bare core. The oblique edges can be positioned against the printed circuit board having solder or otherconductive bumps so that the conductive bumps are jointed with the electrical contacts of the semiconductor bare cores in the holes. The device can be heated to carry out backflow and connects the electrical contacts to the conductive bumps. 公开了以定角度安装在诸如印刷电路板的信号载体介质上的半导体器件。半导体器件包含以阶梯式偏移的配置堆叠的叠半导体裸芯。然后裸芯堆叠体可以被包封在模塑体料中。然后模塑料可以通过沿着两个相对边缘的倾斜切割而分割。然后倾斜的边缘可以钻孔，以暴露在每个半导体裸芯上的电接触。然后倾斜的边缘可以被定位抵靠在具有焊料或者其它导电凸块的印刷电路板上，以便导电凸块与钻孔中的半导体裸芯