SEMICONDUCTOR LIGHT RECEIVING MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT RECEIVING MODULE

Provided is a semiconductor light receiving module provided with a substrate, and with a semiconductor light receiving element that is provided on the substrate and includes a light receiving section.The semiconductor light receiving element has a semiconductor chip and a metal light shielding film,...

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Bibliographische Detailangaben
Hauptverfasser: NISHIO FUMITAKA, KUME MAKIO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Provided is a semiconductor light receiving module provided with a substrate, and with a semiconductor light receiving element that is provided on the substrate and includes a light receiving section.The semiconductor light receiving element has a semiconductor chip and a metal light shielding film, wherein the semiconductor chip includes a first face on which a light receiving section is provided, a second face opposing the first face, and four side faces that connect the first face and the second face and extend in a direction perpendicular to the first face, and the metal light shielding film continuously covers the second face and the four side faces. 本发明提供种具备基板、及设置于基板上且包含受光部的半导体受光元件的半导体受光模块。半导体受光元件具有:半导体芯片,其包含设有受光部的第1面、与第1面相对的第2面、以及连接第1面与第2面且在垂直于第1面的方向上延伸的4个侧面;以及金属制的遮光膜,其连续包覆第2面及4个侧面。