METHODS OF FABRICATION OF CHIP CARDS AND OF CHIP CARD ANTENNA SUPPORTS
The invention relates to a method for fabricating chip cards. According to this method, an antenna and a chip card module (400) are provided. This chip card module (400) comprises a dielectric substrate and conducting tracks at least on a face of this substrate. A connection unit (300) is used to es...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for fabricating chip cards. According to this method, an antenna and a chip card module (400) are provided. This chip card module (400) comprises a dielectric substrate and conducting tracks at least on a face of this substrate. A connection unit (300) is used to establish a connection between the antenna and conducting tracks of the module (400). The invention also relates to a method for fabricating an antenna support comprising such a connection unit (300). The invention also relates to a chip card and an antenna support which are obtained by the aforementioned methods.
本发明涉及种芯片卡的制造方法。根据所述方法,提供了天线和芯片卡模块(400)。所述芯片卡模块(400)包括介电基板及在所述基板的至少面上的导电迹线。连接单元(300)用于在天线与模块(400)的导电迹线之间建立连接。本发明还涉及种用于制造包括所述连接单元(300)的天线支撑件的方法。本发明还涉及通过上述方法获得的芯片卡和天线支撑件。 |
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