Circuit board with heat guiding and heat dissipation functions
The invention provides a circuit board with heat guiding and heat dissipation functions. The circuit board comprises a board body, multiple electronic elements arranged on the board body, and a firstinsulation heat dissipation material which coats the board body and covers the electronic elements. T...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | LIN QIULANG |
description | The invention provides a circuit board with heat guiding and heat dissipation functions. The circuit board comprises a board body, multiple electronic elements arranged on the board body, and a firstinsulation heat dissipation material which coats the board body and covers the electronic elements. The first insulation heat dissipation material comprises a first heat dissipation surface which is parallelly separated from the board body so as to absorb heat energy generated during operation of the electronic elements and carry out heat dissipation uniformly from the first heat dissipation surface, thereby generating uniform and good heat dissipation effects. Thus, an electronic product cooperating with the electronic board is advantageous in that a consumer is enabled to have comfort and good use experience; and due to the good heat dissipation effects of the circuit board, stable system operation and long service lifetime are achieved.
种具导热及散热功能的电路板,包含板体、多个设置于所述板体上的电子元件,及涂布于所述板体上且包覆所述电子元件的第绝缘散热材。其中,所述第绝缘散热材具有与 |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN108882502A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN108882502A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN108882502A3</originalsourceid><addsrcrecordid>eNrjZLBzzixKLs0sUUjKTyxKUSjPLMlQyEhNLFFIL81MycxLV0jMS4EIpGQWF2cWJJZk5ucppJXmJYMYxTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DAwsLCyNTAyNGYGDUAU3Uwng</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit board with heat guiding and heat dissipation functions</title><source>esp@cenet</source><creator>LIN QIULANG</creator><creatorcontrib>LIN QIULANG</creatorcontrib><description>The invention provides a circuit board with heat guiding and heat dissipation functions. The circuit board comprises a board body, multiple electronic elements arranged on the board body, and a firstinsulation heat dissipation material which coats the board body and covers the electronic elements. The first insulation heat dissipation material comprises a first heat dissipation surface which is parallelly separated from the board body so as to absorb heat energy generated during operation of the electronic elements and carry out heat dissipation uniformly from the first heat dissipation surface, thereby generating uniform and good heat dissipation effects. Thus, an electronic product cooperating with the electronic board is advantageous in that a consumer is enabled to have comfort and good use experience; and due to the good heat dissipation effects of the circuit board, stable system operation and long service lifetime are achieved.
种具导热及散热功能的电路板,包含板体、多个设置于所述板体上的电子元件,及涂布于所述板体上且包覆所述电子元件的第绝缘散热材。其中,所述第绝缘散热材具有与</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181123&DB=EPODOC&CC=CN&NR=108882502A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181123&DB=EPODOC&CC=CN&NR=108882502A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN QIULANG</creatorcontrib><title>Circuit board with heat guiding and heat dissipation functions</title><description>The invention provides a circuit board with heat guiding and heat dissipation functions. The circuit board comprises a board body, multiple electronic elements arranged on the board body, and a firstinsulation heat dissipation material which coats the board body and covers the electronic elements. The first insulation heat dissipation material comprises a first heat dissipation surface which is parallelly separated from the board body so as to absorb heat energy generated during operation of the electronic elements and carry out heat dissipation uniformly from the first heat dissipation surface, thereby generating uniform and good heat dissipation effects. Thus, an electronic product cooperating with the electronic board is advantageous in that a consumer is enabled to have comfort and good use experience; and due to the good heat dissipation effects of the circuit board, stable system operation and long service lifetime are achieved.
种具导热及散热功能的电路板,包含板体、多个设置于所述板体上的电子元件,及涂布于所述板体上且包覆所述电子元件的第绝缘散热材。其中,所述第绝缘散热材具有与</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBzzixKLs0sUUjKTyxKUSjPLMlQyEhNLFFIL81MycxLV0jMS4EIpGQWF2cWJJZk5ucppJXmJYMYxTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DAwsLCyNTAyNGYGDUAU3Uwng</recordid><startdate>20181123</startdate><enddate>20181123</enddate><creator>LIN QIULANG</creator><scope>EVB</scope></search><sort><creationdate>20181123</creationdate><title>Circuit board with heat guiding and heat dissipation functions</title><author>LIN QIULANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108882502A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN QIULANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN QIULANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit board with heat guiding and heat dissipation functions</title><date>2018-11-23</date><risdate>2018</risdate><abstract>The invention provides a circuit board with heat guiding and heat dissipation functions. The circuit board comprises a board body, multiple electronic elements arranged on the board body, and a firstinsulation heat dissipation material which coats the board body and covers the electronic elements. The first insulation heat dissipation material comprises a first heat dissipation surface which is parallelly separated from the board body so as to absorb heat energy generated during operation of the electronic elements and carry out heat dissipation uniformly from the first heat dissipation surface, thereby generating uniform and good heat dissipation effects. Thus, an electronic product cooperating with the electronic board is advantageous in that a consumer is enabled to have comfort and good use experience; and due to the good heat dissipation effects of the circuit board, stable system operation and long service lifetime are achieved.
种具导热及散热功能的电路板,包含板体、多个设置于所述板体上的电子元件,及涂布于所述板体上且包覆所述电子元件的第绝缘散热材。其中,所述第绝缘散热材具有与</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN108882502A |
source | esp@cenet |
subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Circuit board with heat guiding and heat dissipation functions |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-16T00%3A06%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIN%20QIULANG&rft.date=2018-11-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN108882502A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |