MULTI-LAYER PLASMA EROSION PROTECTION FOR CHAMBER COMPONENTS

A method of applying a multi-layer plasma resistant coating on an article comprises performing plating or ALD to form a conformal first plasma resistant layer on an article, wherein the conformal first plasma resistant layer is formed on a surface of the article and on walls of high aspect ratio fea...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TRAN TOAN, LAKSHESWAR KALITA, LUBOMIRSKY DMITRY, CHOU CHENG-HSUAN, WU XIAOWEI, HE XIAO-MING, KIM TAE WON, SUN JENNIFER Y
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method of applying a multi-layer plasma resistant coating on an article comprises performing plating or ALD to form a conformal first plasma resistant layer on an article, wherein the conformal first plasma resistant layer is formed on a surface of the article and on walls of high aspect ratio features in the article. The conformal first plasma resistant coating has a porosity of approximately 0% and a thickness of approximately 200 nm to approximately 1 micron. One of electron beam ion assisted deposition (EB-IAD), plasma enhanced chemical vapor deposition (PECVD), aerosol deposition or plasma spraying is then performed to form a second plasma resistant layer that covers the conformal first plasma resistant layer at a region of the surface but not at the walls of the high aspect ratio features. 种在制品上施加多层抗等离子体涂层的方法包括执行镀覆或ALD以在制品上形成保形的第抗等离子体层,其中保形的第抗等离子体层被形成在制品的表面上以及制品中的高深宽比特征的壁上。保形的第抗等离子体涂层具有大约0%的孔隙率和大约200纳米至大约1微米的厚度。随后执行电子束离子辅助沉积(EB-IAD)、等离子体增强化学气相沉积(PECVD)、气溶胶沉积或等离子体喷涂中的者,以形成第二抗等离子体层,该第二抗等离子体层覆盖所述表面的区域处的该