Printed circuit board manufacturing method and printed circuit board

The invention provides a printed circuit board manufacturing method and a printed circuit board; the method comprises the following steps: printing a buffer material on a router bit path on the PCB surface; using a high temperature to bake the buffer material, and enabling the buffer material to attach to the PCB surface; processing a routing process on the PCB along the router bit path printed with the buffer material. The printed circuit board manufacturing method and the printed circuit board print the buffer material on the router bit path of the PCB surface, bake the buffer material at high temperature, enable the buffer material to attach to the PCB surface, and route the PCB along the router bit path printed with the buffer material, thus alleviating a machinery impact of the routing router bit, protecting the PCB from being harmed, effectively reducing PCB popping or layering frequency in routing segmentation, and improving the product reliability. 本发明提供种印刷电路板制作方法及印刷电路板，其中方法包括：在印刷电路板表面的锣刀路径上印刷缓冲材料；对所述