Method and structure that prevent thermal expansion-caused distortion in printed circuit board (PCB) and wafer jointing process

The invention relates to a method and structure that prevent thermal expansion-caused distortions in a printed circuit board (PCB) and wafer jointing process; the method comprises the following steps:A, preparing a wafer, gluing the bottom of the wafer on a first gluing sheet; B, attaching a PCB on...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YE XIUHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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