Method and structure that prevent thermal expansion-caused distortion in printed circuit board (PCB) and wafer jointing process

The invention relates to a method and structure that prevent thermal expansion-caused distortions in a printed circuit board (PCB) and wafer jointing process; the method comprises the following steps:A, preparing a wafer, gluing the bottom of the wafer on a first gluing sheet; B, attaching a PCB on one side, different from the first gluing sheet, of the wafer; C, placing said structure on a toolframe, forming a central hole in the tool frame center, enabling the first gluing sheet to extend to the periphery of the top surface of the central hole, thus attaching the whole structure on the tool frame; D, using a lift tool to lift from a position below the central hole toward the center of the first gluing sheet, wherein the contact area between the lift tool and the first gluing sheet is greater than the bottom area of the wafer; using the support force of the first gluing sheet to strut the wafer and the PCB attached thereon; E, using a cutter to cut the wafer periphery on the first gluing sheet. 种用于防止印刷电路板及晶圆