Circuit protecting element and multilayer structure for manufacturing same

The invention provides a circuit protecting element and a multilayer structure for manufacturing the same. The multilayer structure comprises an upper surface layer, at least two layers of conductivechips and a lower surface layer which are sequentially stacked and is characterized in that the upper...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU MEIYI, FU LINXIANG, ZHAO LIANG, ZANG YUFENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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