Circuit protecting element and multilayer structure for manufacturing same

The invention provides a circuit protecting element and a multilayer structure for manufacturing the same. The multilayer structure comprises an upper surface layer, at least two layers of conductivechips and a lower surface layer which are sequentially stacked and is characterized in that the upper surface layer is fixedly adhered to the conductive chip adjacent to the upper surface layer through at least one adhesive layer, every two adjacent conductive chips are fixedly adhered through at least one adhesive layer, and the conductive chip adjacent to the lower surface layer is fixedly adhered through at least one adhesive layer to form the stacked structure; each conductive chip sequentially comprises an upper electrode layer, a positive temperature coefficient layer and a lower electrode layer, and each adhesive layer is made of insulating materials; each of the upper surface layer and the lower surface layer is formed by conductive layers and insulating layers, the conductive layers and the insulating lay