Multi-layer, stress-isolation platform for MEMS die

Multi-layer, stress-isolation platform for MEMS die

A multi-layer, stress-isolation platform is configured for attaching a MEMS die to a base includes a first platform; a first layer of attachment material between the base and the first platform and attaching the first platform to the base; a MEMS die; and a second layer of attachment material betwee...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LONG WAYNE C, NGUYEN JOSEPH L
Format: Patent
Sprache:chi ; eng
Schlagworte:
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:A multi-layer, stress-isolation platform is configured for attaching a MEMS die to a base includes a first platform; a first layer of attachment material between the base and the first platform and attaching the first platform to the base; a MEMS die; and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform. 种多层应力隔离平台，其配置为将MEMS裸芯附接至基部，其包括第平台；第层附接材料，其在所述基部与所述第平台之间，并且将所述第平台附接至所述基部；MEMS裸芯；以及第二层附接材料，其在所述第平台与所述MEMS裸芯之间，并且将所述MEMS裸芯附接至所述第平台。