TRENCH-BASED MICROELECTROMECHANICAL TRANSDUCER AND METHOD FOR MANUFACTURING THE MICROELECTROMECHANICAL TRANSDUCER

The disclosure relates to a trench-based microelectromechanical transducer and a method for manufacturing the microelectromechanical transducer. For example, a microelectromechanical transducer includes: a semiconductor body, having a first surface and a second surface opposite to one another; a first structural body, coupled to the first surface of the semiconductor body; a first sealed cavity between the semiconductor body and the first structural body; and an active area housed in the first sealed cavity, including at least two trenches and a sensor element between the trenches. The trenches extend along a vertical direction from the first surface towards the second surface of the semiconductor body. 本公开涉及基于沟槽的微机电换能器及制造该微机电换能器的方法。例如，种微机电换能器包括：半导体本体，具有彼此相对的第表面和第二表面；第结构本体，耦合至半导体本体的第表面；第密封腔，位于半导体本体和第结构本体之间；以及活跃区域，容纳在第密封腔中，包括至少两个沟槽以及沟槽之间的传感器元件。沟槽沿着从半导体本体的第表面朝向第二表面的垂直方向延伸。