Integrated forming preparation process for copper alloy and phenolic plastic
The invention relates to an integrated forming preparation process for a copper alloy and phenolic plastic. The surface of a copper alloy substrate is subjected to micropore treatment, and a pluralityof nanopores are formed; and then, the phenolic plastic is injected in the nanopores, and the phenol...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WU XIANGYIN |
| description | The invention relates to an integrated forming preparation process for a copper alloy and phenolic plastic. The surface of a copper alloy substrate is subjected to micropore treatment, and a pluralityof nanopores are formed; and then, the phenolic plastic is injected in the nanopores, and the phenolic plastic and the copper alloy substrate are fully compounded. The integrated forming preparationprocess for the copper alloy and the phenolic plastic has the beneficial effects that compared with the prior art, the process is simple, the cost is low, combination is close, and durability is achieved.
本发明涉及种铜合金与酚醛塑料的体化成型制备工艺，在铜合金基板表面微孔处理，形成若干纳米孔，然后在纳米孔上注入酚醛塑料，使酚醛塑料与铜合金基板充分复合。本发明的有益效果在于：与现有技术相比，工艺简单成本低、结合紧密耐用的特点。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN108789989A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN108789989A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN108789989A3</originalsourceid><addsrcrecordid>eNqNijEKAjEQRdNYiHqH8QCCYmG2lEVRECv7Zcj-XQNxZkjSeHtX8ABW__Hen7vbVSrGzBU9DZpfUUayDONJRZWJNaCUb6OgZsjEKembWHqyJ0RTDGSJS41h6WYDp4LVbxdufT492ssGph2KcYCgdu19t_UH3zS-Oe7_-XwA66g2jA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrated forming preparation process for copper alloy and phenolic plastic</title><source>esp@cenet</source><creator>WU XIANGYIN</creator><creatorcontrib>WU XIANGYIN</creatorcontrib><description>The invention relates to an integrated forming preparation process for a copper alloy and phenolic plastic. The surface of a copper alloy substrate is subjected to micropore treatment, and a pluralityof nanopores are formed; and then, the phenolic plastic is injected in the nanopores, and the phenolic plastic and the copper alloy substrate are fully compounded. The integrated forming preparationprocess for the copper alloy and the phenolic plastic has the beneficial effects that compared with the prior art, the process is simple, the cost is low, combination is close, and durability is achieved.
本发明涉及种铜合金与酚醛塑料的体化成型制备工艺，在铜合金基板表面微孔处理，形成若干纳米孔，然后在纳米孔上注入酚醛塑料，使酚醛塑料与铜合金基板充分复合。本发明的有益效果在于：与现有技术相比，工艺简单成本低、结合紧密耐用的特点。</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; APPARATUS THEREFOR ; CHEMISTRY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; MAKING GRANULES OR PREFORMS ; METALLURGY ; PERFORMING OPERATIONS ; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED ; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS ; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181113&DB=EPODOC&CC=CN&NR=108789989A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181113&DB=EPODOC&CC=CN&NR=108789989A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU XIANGYIN</creatorcontrib><title>Integrated forming preparation process for copper alloy and phenolic plastic</title><description>The invention relates to an integrated forming preparation process for a copper alloy and phenolic plastic. The surface of a copper alloy substrate is subjected to micropore treatment, and a pluralityof nanopores are formed; and then, the phenolic plastic is injected in the nanopores, and the phenolic plastic and the copper alloy substrate are fully compounded. The integrated forming preparationprocess for the copper alloy and the phenolic plastic has the beneficial effects that compared with the prior art, the process is simple, the cost is low, combination is close, and durability is achieved.
本发明涉及种铜合金与酚醛塑料的体化成型制备工艺，在铜合金基板表面微孔处理，形成若干纳米孔，然后在纳米孔上注入酚醛塑料，使酚醛塑料与铜合金基板充分复合。本发明的有益效果在于：与现有技术相比，工艺简单成本低、结合紧密耐用的特点。</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>MAKING GRANULES OR PREFORMS</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</subject><subject>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><subject>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEKAjEQRdNYiHqH8QCCYmG2lEVRECv7Zcj-XQNxZkjSeHtX8ABW__Hen7vbVSrGzBU9DZpfUUayDONJRZWJNaCUb6OgZsjEKembWHqyJ0RTDGSJS41h6WYDp4LVbxdufT492ssGph2KcYCgdu19t_UH3zS-Oe7_-XwA66g2jA</recordid><startdate>20181113</startdate><enddate>20181113</enddate><creator>WU XIANGYIN</creator><scope>EVB</scope></search><sort><creationdate>20181113</creationdate><title>Integrated forming preparation process for copper alloy and phenolic plastic</title><author>WU XIANGYIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108789989A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>MAKING GRANULES OR PREFORMS</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</topic><topic>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</topic><topic>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>WU XIANGYIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU XIANGYIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrated forming preparation process for copper alloy and phenolic plastic</title><date>2018-11-13</date><risdate>2018</risdate><abstract>The invention relates to an integrated forming preparation process for a copper alloy and phenolic plastic. The surface of a copper alloy substrate is subjected to micropore treatment, and a pluralityof nanopores are formed; and then, the phenolic plastic is injected in the nanopores, and the phenolic plastic and the copper alloy substrate are fully compounded. The integrated forming preparationprocess for the copper alloy and the phenolic plastic has the beneficial effects that compared with the prior art, the process is simple, the cost is low, combination is close, and durability is achieved.
本发明涉及种铜合金与酚醛塑料的体化成型制备工艺，在铜合金基板表面微孔处理，形成若干纳米孔，然后在纳米孔上注入酚醛塑料，使酚醛塑料与铜合金基板充分复合。本发明的有益效果在于：与现有技术相比，工艺简单成本低、结合紧密耐用的特点。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN108789989A |
| source | esp@cenet |
| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS THEREFOR CHEMISTRY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MAKING GRANULES OR PREFORMS METALLURGY PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Integrated forming preparation process for copper alloy and phenolic plastic |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T11%3A28%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WU%20XIANGYIN&rft.date=2018-11-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN108789989A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |