Integrated forming preparation process for copper alloy and phenolic plastic

The invention relates to an integrated forming preparation process for a copper alloy and phenolic plastic. The surface of a copper alloy substrate is subjected to micropore treatment, and a pluralityof nanopores are formed; and then, the phenolic plastic is injected in the nanopores, and the phenolic plastic and the copper alloy substrate are fully compounded. The integrated forming preparationprocess for the copper alloy and the phenolic plastic has the beneficial effects that compared with the prior art, the process is simple, the cost is low, combination is close, and durability is achieved. 本发明涉及种铜合金与酚醛塑料的体化成型制备工艺，在铜合金基板表面微孔处理，形成若干纳米孔，然后在纳米孔上注入酚醛塑料，使酚醛塑料与铜合金基板充分复合。本发明的有益效果在于：与现有技术相比，工艺简单成本低、结合紧密耐用的特点。