Method and structure for preventing solder flow into a MEMS pressure port

The invention discloses a method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment. The method includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation. 本发明公开了用于在MEMS芯片附接过程中防止焊料流入MEMS压力口的方法和结构。该方法包括：在流体入口构件的压力口的内表面上涂覆层阻焊剂，所述流体入口构件具有第轴向端、第二轴向端、以及形成在流体入口构件的第二轴向端中的压力口的开放口。将焊料预成型件布置在流体入口构件的安装面上，并将MEMS芯片布置在焊料预成型件上。在回流操作中对焊料预成型件进行加热，以将MEMS芯片附接至安装面，其中，压力口中的阻焊剂防止熔融焊料在回流操作过程中进入压力口。