Method and apparatus for room temperature bonding substrates

A particle micro/nanoparticle filled paste (10) is employed to create an absorbing/sintering interlayer (65) for a bonding process which avoids the need to grind/polish large substrates (11, 12) and eliminates the need for more expensive sputtering process. 使用种颗粒微米/纳米颗粒填充糊剂(10)来形成吸收/烧结中间层(65)以用于结合工艺...

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Bibliographische Detailangaben
Hauptverfasser:	LAFLEUR ROCCO, KARAM RAYMOND M, HOBDEN ROB
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Zusammenfassung:	A particle micro/nanoparticle filled paste (10) is employed to create an absorbing/sintering interlayer (65) for a bonding process which avoids the need to grind/polish large substrates (11, 12) and eliminates the need for more expensive sputtering process. 使用种颗粒微米/纳米颗粒填充糊剂(10)来形成吸收/烧结中间层(65)以用于结合工艺，该结合工艺不需要研磨/抛光大型基材(11、12)，并且免除了对更为昂贵的溅射工艺的需要。