Method for cutting adhesive film, adhesive film and roll

The object of the invention is to provide: a novel and improved method for cutting an adhesive film, which is capable of producing an adhesive film that has a width of less than 1 mm, while having a low glass transition point and high quality; and an adhesive film. [Solution] In order to solve the a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATO YOKO, HORIKAWA KAZUHIDE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING DYES HAND CUTTING TOOLS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEVERING TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The object of the invention is to provide: a novel and improved method for cutting an adhesive film, which is capable of producing an adhesive film that has a width of less than 1 mm, while having a low glass transition point and high quality; and an adhesive film. [Solution] In order to solve the above-described problem, one embodiment of the present invention provides a method for cutting an adhesive film that satisfies the condition of mathematical formula (1) and has a tack value per unit area of 3 N/cm or more at room temperature in an environment at a temperature of -40 DEG C to 10 DEG C., wherein y