Method for making PCB (Printed Circuit Board) with ultra-thin buried core board

The invention discloses a method for making a PCB (Printed Circuit Board) with an ultra-thin buried core board. The method comprises the following steps: S1, pretreating the ultra-thin buried core board to form an inner-layer single-sided pattern of the ultra-thin buried core board; S2, performing p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	QIU XIMAN, LI BING, LIU BAOYONG, LI SHENGQIANG, ZHANG ZHIPING, LI ZHIXIONG, CHEN XIAONING, BAI KERONG, LU BAOMIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!