Method for making PCB (Printed Circuit Board) with ultra-thin buried core board

The invention discloses a method for making a PCB (Printed Circuit Board) with an ultra-thin buried core board. The method comprises the following steps: S1, pretreating the ultra-thin buried core board to form an inner-layer single-sided pattern of the ultra-thin buried core board; S2, performing primary lamination on the ultra-thin buried core board pretreated in the step S1 and an FR4 PP boardto form a three-layer board; and S3, performing secondary lamination on the three-layer board obtained in the step S2 and other inner-layer core boards to form a target board body. Through adoption ofthe method for making the PCB with the ultra-thin buried core board disclosed by the invention, layer deviation scrap caused by unstable expansion and contraction due to original flow lamination is reduced greatly; the yield is increased; the cost is lowered; and the delivery time of a product is stable. 本发明公开了种超薄埋容芯板的PCB板制作方法。步骤S1：将超薄埋容芯板预处理以形成超薄埋容芯板的内层单面图形。步骤S2：将步骤S1中经预处理的超薄埋容芯板与FR4 PP板进行第次压合以形成三层板。步骤S3：将步骤S2中三层板与其他内层芯板