Method for making PCB (Printed Circuit Board) with ultra-thin buried core board
The invention discloses a method for making a PCB (Printed Circuit Board) with an ultra-thin buried core board. The method comprises the following steps: S1, pretreating the ultra-thin buried core board to form an inner-layer single-sided pattern of the ultra-thin buried core board; S2, performing p...
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| creator | QIU XIMAN LI BING LIU BAOYONG LI SHENGQIANG ZHANG ZHIPING LI ZHIXIONG CHEN XIAONING BAI KERONG LU BAOMIN |
| description | The invention discloses a method for making a PCB (Printed Circuit Board) with an ultra-thin buried core board. The method comprises the following steps: S1, pretreating the ultra-thin buried core board to form an inner-layer single-sided pattern of the ultra-thin buried core board; S2, performing primary lamination on the ultra-thin buried core board pretreated in the step S1 and an FR4 PP boardto form a three-layer board; and S3, performing secondary lamination on the three-layer board obtained in the step S2 and other inner-layer core boards to form a target board body. Through adoption ofthe method for making the PCB with the ultra-thin buried core board disclosed by the invention, layer deviation scrap caused by unstable expansion and contraction due to original flow lamination is reduced greatly; the yield is increased; the cost is lowered; and the delivery time of a product is stable.
本发明公开了种超薄埋容芯板的PCB板制作方法。步骤S1：将超薄埋容芯板预处理以形成超薄埋容芯板的内层单面图形。步骤S2：将步骤S1中经预处理的超薄埋容芯板与FR4 PP板进行第次压合以形成三层板。步骤S3：将步骤S2中三层板与其他内层芯板 |
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本发明公开了种超薄埋容芯板的PCB板制作方法。步骤S1：将超薄埋容芯板预处理以形成超薄埋容芯板的内层单面图形。步骤S2：将步骤S1中经预处理的超薄埋容芯板与FR4 PP板进行第次压合以形成三层板。步骤S3：将步骤S2中三层板与其他内层芯板</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181106&DB=EPODOC&CC=CN&NR=108770216A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181106&DB=EPODOC&CC=CN&NR=108770216A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QIU XIMAN</creatorcontrib><creatorcontrib>LI BING</creatorcontrib><creatorcontrib>LIU BAOYONG</creatorcontrib><creatorcontrib>LI SHENGQIANG</creatorcontrib><creatorcontrib>ZHANG ZHIPING</creatorcontrib><creatorcontrib>LI ZHIXIONG</creatorcontrib><creatorcontrib>CHEN XIAONING</creatorcontrib><creatorcontrib>BAI KERONG</creatorcontrib><creatorcontrib>LU BAOMIN</creatorcontrib><title>Method for making PCB (Printed Circuit Board) with ultra-thin buried core board</title><description>The invention discloses a method for making a PCB (Printed Circuit Board) with an ultra-thin buried core board. The method comprises the following steps: S1, pretreating the ultra-thin buried core board to form an inner-layer single-sided pattern of the ultra-thin buried core board; S2, performing primary lamination on the ultra-thin buried core board pretreated in the step S1 and an FR4 PP boardto form a three-layer board; and S3, performing secondary lamination on the three-layer board obtained in the step S2 and other inner-layer core boards to form a target board body. Through adoption ofthe method for making the PCB with the ultra-thin buried core board disclosed by the invention, layer deviation scrap caused by unstable expansion and contraction due to original flow lamination is reduced greatly; the yield is increased; the cost is lowered; and the delivery time of a product is stable.
本发明公开了种超薄埋容芯板的PCB板制作方法。步骤S1：将超薄埋容芯板预处理以形成超薄埋容芯板的内层单面图形。步骤S2：将步骤S1中经预处理的超薄埋容芯板与FR4 PP板进行第次压合以形成三层板。步骤S3：将步骤S2中三层板与其他内层芯板</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD3TS3JyE9RSMsvUshNzM7MS1cIcHZS0AgoyswrSU1RcM4sSi7NLFFwyk8sStFUKM8syVAozSkpStQtycjMU0gqLcoEqkrOL0pVSAIp4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgYW5uYGRoZmjsbEqAEAgOQ1XA</recordid><startdate>20181106</startdate><enddate>20181106</enddate><creator>QIU XIMAN</creator><creator>LI BING</creator><creator>LIU BAOYONG</creator><creator>LI SHENGQIANG</creator><creator>ZHANG ZHIPING</creator><creator>LI ZHIXIONG</creator><creator>CHEN XIAONING</creator><creator>BAI KERONG</creator><creator>LU BAOMIN</creator><scope>EVB</scope></search><sort><creationdate>20181106</creationdate><title>Method for making PCB (Printed Circuit Board) with ultra-thin buried core board</title><author>QIU XIMAN ; LI BING ; LIU BAOYONG ; LI SHENGQIANG ; ZHANG ZHIPING ; LI ZHIXIONG ; CHEN XIAONING ; BAI KERONG ; LU BAOMIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108770216A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>QIU XIMAN</creatorcontrib><creatorcontrib>LI BING</creatorcontrib><creatorcontrib>LIU BAOYONG</creatorcontrib><creatorcontrib>LI SHENGQIANG</creatorcontrib><creatorcontrib>ZHANG ZHIPING</creatorcontrib><creatorcontrib>LI ZHIXIONG</creatorcontrib><creatorcontrib>CHEN XIAONING</creatorcontrib><creatorcontrib>BAI KERONG</creatorcontrib><creatorcontrib>LU BAOMIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QIU XIMAN</au><au>LI BING</au><au>LIU BAOYONG</au><au>LI SHENGQIANG</au><au>ZHANG ZHIPING</au><au>LI ZHIXIONG</au><au>CHEN XIAONING</au><au>BAI KERONG</au><au>LU BAOMIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for making PCB (Printed Circuit Board) with ultra-thin buried core board</title><date>2018-11-06</date><risdate>2018</risdate><abstract>The invention discloses a method for making a PCB (Printed Circuit Board) with an ultra-thin buried core board. The method comprises the following steps: S1, pretreating the ultra-thin buried core board to form an inner-layer single-sided pattern of the ultra-thin buried core board; S2, performing primary lamination on the ultra-thin buried core board pretreated in the step S1 and an FR4 PP boardto form a three-layer board; and S3, performing secondary lamination on the three-layer board obtained in the step S2 and other inner-layer core boards to form a target board body. Through adoption ofthe method for making the PCB with the ultra-thin buried core board disclosed by the invention, layer deviation scrap caused by unstable expansion and contraction due to original flow lamination is reduced greatly; the yield is increased; the cost is lowered; and the delivery time of a product is stable.
本发明公开了种超薄埋容芯板的PCB板制作方法。步骤S1：将超薄埋容芯板预处理以形成超薄埋容芯板的内层单面图形。步骤S2：将步骤S1中经预处理的超薄埋容芯板与FR4 PP板进行第次压合以形成三层板。步骤S3：将步骤S2中三层板与其他内层芯板</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Method for making PCB (Printed Circuit Board) with ultra-thin buried core board |
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