Package structure for temperature and pressure integrated sensor

The invention discloses a package structure for a temperature and pressure integrated sensor. The package structure comprises a temperature sensor, a pressure sensor, a sensor base and a housing, wherein the temperature sensor is mounted in a sensor fixing hole formed in the bottom of the sensor base; the bottom end of the temperature sensor extends out of the sensing fixing hole; a sensor sealingcavity is formed in the top end of the sensor base; the pressure sensor is hermetically mounted in the sensor sealing cavity; a pressure cavity is formed in the lower part of the sensor sealing cavity; a process connector used for being connected with a measured device or pipeline is formed in the side wall at the bottom of the sensor base; the temperature sensor and the pressure sensor are respectively connected with a temperature signal wire and a pressure signal wire; the housing is mounted on the sensor base; and a routing channel for allowing the signal wires to pass through is defined by the housing and the sen