METHOD FOR MANUFACTURING WIRING BOARD

A process for efficiently producing a wiring board in which an insulating substrate (1) having a through hole (2) is used, which includes forming a seed layer (3) on one surface of the insulating substrate (1), covering the surface of the insulating substrate (1) on which the seed layer (3) is formed with a masking film (4), arranging the insulating substrate (1) and a positive electrode (5) so that the surface of the insulating substrate (1) opposite to the surface of the insulating substrate 1) on which the seed layer 3) of the insulating substrate (1) is formed is faced to the positive electrode (5), carrying out electroplating to form a metal layer (8) in the through hole (2), and then removing the masking film (4). 本发明涉及种配线用基板的制造方法，其为使用具有贯通孔(2)的绝缘基板(1)来高效地制造配线用基板的方法，其特征在于，在绝缘基板(1)的个表面形成种子层(3)，用掩蔽膜(4)对形成有种子层(3)的面进行被覆，按照绝缘基板(1)的形成有种子层(3)的面的相反面与阳极(5)对置的方式来配设绝缘基板(1)和阳极(5)并实施电镀，在贯通孔(2)内形成金属层(8)，之后将掩蔽膜(4)除去。