METHOD FOR MANUFACTURING AN LED EMISSIVE DISPLAY AND RESULTING LED EMISSIVE DISPLAY

The present invention provides a method of manufacturing an emissive LED display device, including the steps of forming a plurality of chips, each including at least one LED and, on a connection surface, a plurality of hydrophilic electric connection areas and a hydrophobic area; forming a transfer substrate including, for each chip, a plurality of hydrophilic electric connection areas and a hydrophobic area; arranging a drop of a liquid on each electric connection area of the transfer substrate and/or of each chip; and affixing the chips to the transfer substrate by direct bonding, using thecapillary restoring force of the drops to align the electric connection areas of the chips with the electric connection areas of the transfer substrate. 本发明涉及种制造发射型LED显示装置的方法，包括以下步骤：a)形成多个芯片，其中每个芯片包括至少个LED，并且在连接表面上包括多个亲水性电连接区域和疏水性区域；b)形成传送基板，该传送基板针对每个芯片包括多个亲水性电连接区域和疏水性区域；c)将液体的液滴布置在传送基板的每个电连接区域和/或每个芯片的每个电连接区域上；并且d)通过使用液滴的毛细回复力使芯片的电连接区域与传送基板的电连接区域对准，以由直接结合而将芯片贴附到传送基板。