Wire bonding tool

The invention discloses a wire bonding tool, comprising: a working base; a bonding layer, disposed on one side of the working base; a first diamond layer, formed by a chemical vapor deposition methodon one side of the bonding layer away from the working base and in direct contact with the bonding la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HE JIAZHE, CHEN TAIJIA, GU FENGQI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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