Wire bonding tool

The invention discloses a wire bonding tool, comprising: a working base; a bonding layer, disposed on one side of the working base; a first diamond layer, formed by a chemical vapor deposition methodon one side of the bonding layer away from the working base and in direct contact with the bonding layer, wherein the first diamond layer has a single layer structure; and a wire bonding head, disposed on one side of the first diamond layer away from the bonding layer and in direct contact with the first diamond layer, wherein the wire bonding head is formed by sintering treatment through a diamond micro powder and a silicon carbide micro powder. The first diamond layer not only helps to strengthen the joint between the working base and the wire bonding head, but also reduces the deformation degree of the working surface of the wire bonding tool at a high temperature, thereby improving the service life of the wire bonding tool. 本发明公开了种打线工具，包含工作座；结合层，设置在该工作座的侧；第钻石层，以化学气相沉积法形成在该结合层远离该工作座的侧并直接接触该结合层，该第钻石层具有单层结构；以及打线头