Apparatus and method for emulating temperature during a thermal cure cycle

The invention provides an apparatus and a method for emulating temperature during a thermal cure cycle. The apparatus includes an enclosure assembly including an enclosure assembly-leading end and anopposed enclosure assembly-lagging end, and a temperature emulation assembly mounted within the enclosure assembly and including a temperature emulation assembly-leading end located proximate to the enclosure assembly-leading end and a temperature emulation assembly-lagging end spaced away from the enclosure assembly-lagging end. The enclosure assembly thermally isolates the temperature emulationassembly. The enclosure assembly permits conductive heat transfer to the temperature emulation assembly only through the enclosure assembly-leading end. 本发明的题目是用于在热固化周期期间模拟温度的设备和方法。设备包括壳体组件，其包括壳体组件-前端和相对的壳体组件-后端；和温度模拟组件，其安装在壳体组件内并且包括靠近壳体组件-前端定位的温度模拟组件-前端和与壳体组件-后端间隔开的温度模拟组件-后端。壳体组件热隔离温度模拟组件。壳体组件允许仅通过壳体组件-前端至温度模拟组件的传导热传递。