EPOXY RESIN SYSTEM, USE OF AN EPOXY RESIN SYSTEM, OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN EPOXY RESIN SYSTEM

The invention relates to an epoxy resin system comprising at least one inorganic filler (F) which has an upper particle size (dmax) of a maximum of 30 [mu]m and is an oxide or nitride of a metal or asemimetal, at least one cycloaliphatic epoxy resin, polyvinyl butyral, at least one cationic accelera...

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Bibliographische Detailangaben
Hauptverfasser:	HOHN KLAUS, KEITH CHRISTINA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention relates to an epoxy resin system comprising at least one inorganic filler (F) which has an upper particle size (dmax) of a maximum of 30 [mu]m and is an oxide or nitride of a metal or asemimetal, at least one cycloaliphatic epoxy resin, polyvinyl butyral, at least one cationic accelerator, and wherein the epoxy resin system is a single-component system for thin-walled structural elements. 本发明涉及种环氧树脂体系，所述环氧树脂体系包括：具有最大30μm的粒度上限(d)的至少种无机填充材料(F)，所述无机填充材料是金属或半金属的氧化物或氮化物；至少种脂环族环氧树脂；聚乙烯基丁醛；至少种阳离子促进剂，并且其中环氧树脂体系是用于薄壁的结构元件的单组份体系。