Flat micro-channel loop heat pipe with width of fluid pipe being optimized
The invention provides a flat micro-channel loop heat pipe with optimized fluid pipe width, and the heat pipe comprises a mainboard and an upper cover plate, wherein the upper cover plate is packagedwith the mainboard. The mainboard comprises an evaporation chamber and a condensing chamber, and stea...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a flat micro-channel loop heat pipe with optimized fluid pipe width, and the heat pipe comprises a mainboard and an upper cover plate, wherein the upper cover plate is packagedwith the mainboard. The mainboard comprises an evaporation chamber and a condensing chamber, and steam pipes and a liquid pipe are connected between the evaporation chamber and the condensing chamber.The interior of the evaporation chamber is provided with a porous dielectric piece. The upper cover plate is provided with a cavity, and the cavity is communicated with the steam pipes. The cavity isdisposed to be opposite to the porous dielectric piece. The width of the steam pipes is 2-5 times of the width of the liquid pipe. According to the invention, the number of the stream pipes is increased, so as to reduce the pressure reduction of steam, increase the transmission distance of steam, and improve the operation efficiency of a device.
本发明提供了种平板式微型环路热管,包括主板和上盖板,所述上盖板与主板封装在起,所述主板包括蒸发室、冷凝室,蒸发室和冷凝室之间连接蒸汽管道和液体管道,所述蒸发 |
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