Heat dissipating device
A heat dissipating device is provided and is applied to a computer case. The heat dissipating device comprises a heat dissipating module and an air guiding hood; the heat dissipating module comprisesa heat sink and a fan; the fan comprises a first side wall and a second side wall; the air guiding ho...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A heat dissipating device is provided and is applied to a computer case. The heat dissipating device comprises a heat dissipating module and an air guiding hood; the heat dissipating module comprisesa heat sink and a fan; the fan comprises a first side wall and a second side wall; the air guiding hood comprises an air guiding portion and a mounting portion extending from the air guiding portion;the first side wall of the fan is mounted with the mounting portion, and the second side of the fan is mounted with the heat sink; the fan is arranged between the heat sink and the air guiding hood; the air guiding portion is provided with an air guiding passage; and the fan drives the air flow to the air guiding portion to make the air pass through the air guiding passage, so that the heat of theheat sink can be taken away through the air guiding passage.
种散热装置，应用于电脑机箱中，包括散热模组及导风罩，所述散热模组包括散热器及风扇，所述风扇包括第侧璧及第二侧璧，所述导风罩包括导风部及自所述导风部延伸形成的安装部，所述风扇的第侧璧与所述安装部安装，所述风扇的第二侧璧与所述散热器安装，所述风扇安装于所述散热器与所导风罩之间，所述导风部设有导风通道，所述风扇带动空气流流向所述导风部 |
|---|