Photosensitive compositions and application thereof

The invention relates to photosensitive compositions and application thereof. The compositions include polyester amic acid (A), a compound (B) having a polymeric double bond, a photopolymerization initiator (C), an epoxy-containing polymer (D) having a weight-average molecular weight of 3,000-50,000, an epoxy compound (E) having 2-10 epoxy groups in each molecule and having a weight-average molecular weight of less than 3000, an epoxy hardener (F) and a molecular weight adjusting agent (G). The compositions don't need organic solvents having high polarity, and can form hardened films having excellent transparency, heat resistance, chemical resistance, flatness, resolution, and chemical resistance, and being suitable for use in electronic parts. 本发明涉及种感光性组合物及其应用，其包含聚酯酰胺酸(A)、具有聚合性双键的化合物(B)、光聚合引发剂(C)、重量平均分子量为3,000～50,000的具有环氧基的聚合物(D)、在每分子中包含2个～10个环氧基且重量平均分子量未满3,000的环氧化合物(E)、环氧硬化剂(F)、及分子量调整剂(G)。本发明的感光性组合物不需要极性高的有机溶剂，可形成透明性、耐热性、耐化学品性、平坦性、解析性、及耐化学品性优异且可适合用于电子零件的硬化膜。