SOLDER COMPOSITION FOR PRECOATING, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, SOLDER COMPOSITION, AND METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE

The invention provides a solder composition for precoating, the solder composition comprises a welding flux composition and (D) solder powder, the welding flux composition contains (A) rosin resin, (B) an active agent and (C) a solvent, wherein (B) component contains (B1)N, N, N', N'-tetra...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBASAKI MASANORI, KIMURA HITOMI, IIJIMA NORISHIGE, HARA TAKUMI, KOUICHI ISHIGAKI, USUKURA SHINICHI, YOSHIZAWA SHINJI, SAKAI YUUKI, IWABUCHI MITSURU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention provides a solder composition for precoating, the solder composition comprises a welding flux composition and (D) solder powder, the welding flux composition contains (A) rosin resin, (B) an active agent and (C) a solvent, wherein (B) component contains (B1)N, N, N', N'-tetrakis(2-hydroxypropyl)ethylenediamine, and in the (D) component, particles with a particle size of 5 [mu]m or less is more than 40% volume%. 本发明提供种预涂层用焊料组合物，其含有焊剂组合物和(D)焊料粉末，所述焊剂组合物含有(A)松香类树脂、(B)活化剂和(C)溶剂，其中，所述(B)成分含有(B1)N,N,N',N'-四(2-羟丙基)乙二胺，在所述(D)成分中，粒径5μm以下的粒子为40体积％以上。